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Injection Molded Heat Dissipation Housing for Communication Equipment

Min. order: --

Product Info

Category: Molding

Material: Thermoplastic

Capacity: --

Factory

ShenZhen, Guangdong, China
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Employees
101-200
Factory Size
10,000-30,000 ㎡
Year Established
2011

About Injection Molded Heat Dissipation Housing for Communication Equipment

We provide 3D digital models and 2D engineering drawings detailing wall thickness distribution and assembly relationships to facilitate the evaluation of shrinkage rates in deep-cavity molding and snap-fit clearances. The part features an elongated box-shaped structure with densely distributed longitudinal cooling fins on the surface. The side walls are equipped with multiple locating pins and mounting slots, while the bottom includes molded CE certification marks and recycling symbols. This component serves as a typical protective and heat-dissipating enclosure for electronic devices.

Thin-walled, large-area structures like this are prone to warpage during injection molding. Therefore, precise control of the mold cooling channel layout is essential to balance shrinkage stresses, ensuring that the fin ribs are free from short shots and flash, and that overall flatness meets the assembly requirements for PCBs or internal components. As the primary load-bearing points, the root fillet design and dimensional tolerances of the side snaps and screw bosses directly impact assembly robustness. We optimize gate locations through mold flow analysis to minimize the impact of weld lines on structural strength.

Leveraging high-precision mold manufacturing capabilities, including MAKINO wire EDM and mirror-finish spark erosion machines, we ensure the clear formation of complex cooling fins and fine characters. Production utilizes fully electric high-speed injection molding machines from Japanese brands such as TOYO and NISSEI to achieve stable mass production and effectively reduce dimensional variations between batches. We perform full-dimensional inspections of key mounting holes and external profiles using Coordinate Measuring Machines (CMM). Our processes comply with ISO 9001 and IATF 16949 quality management standards, making these parts suitable for demanding applications such as communication base stations and industrial routers where heat dissipation and protection are critical.

Product Info

Product Category
Molding
Material
Thermoplastic
Capacity
--
Minimum Order Quantity (MOQ)
--

Frequently Asked Questions

We use Serein CMMs to perform full-dimensional inspections on key mounting positions. To address warpage issues in thin-walled structures, we rely on MAKINO wire EDM for precision mold making and TOYO electric injection molding machines for stable mass production. This approach effectively controls shrinkage stress, ensuring the cooling fins are free from short shots and the overall flatness meets PCB assembly requirements.

About Factory

Core Services

Molding
Mold Making

Factory Info

Process
Molding, Mold Making
Address
1/F, Building C, Guancheng High-Tech Park, No. 2 Xiguangyue 1st Road, Loucun Community, Xinhu Street, Guangming District, Shenzhen City, ShenZhen
Region
Guangdong, China
Certification
ISO 9001, GJB9001c-2017
Year Founded
2011
Outsourced Secondary Processes
Communication Industry
Consumer Electronics
Home Appliances
Lighting Industry
Robotics Industry
Medical Equipment
Automotive Industry
Computer Hardware Industry
Outdoor Recreation Industry
Toys and Gifts industry
Measuring and Control Instruments
Special-Purpose Robots
Pharmaceutical Biotechnology
Drones Industry
Motorsport Industries
Sporting Goods
Military Industries
Power Tools Industry
Embodied AI
Aerospace Industry
Factory Size
10,000-30,000 ㎡
Type of Enterprise
Industry combined
Number of Employees
101-200
Annual Revenue
$12,000,001+
Main Market
China
Europe
South East Asia
North America
Japan & Korea
Middle East
Central & South America
Southern Asia & India
Africa

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